| COMPONENTS | Sensor head with embedded real-time processing electronics and connectors. Imaging lens. Software for system configuration and analysis. Infrared emitter for initial focus and optical calibration. |
|---|---|
| PROCESS COMPATIBILITY | High speed LMD (Laser Metal Deposition) process. |
| OPTICS REQUIREMENTS | Optical path transparent to infrared radiation (above 1.1 um) from the process area to the optical port is required. * |
| DIMENSIONS / WEIGHT | 84 mm x 60 mm x 42.5 mm / 0.5 kg |
| POWER SUPPLY | 5 VDC, 10W |
| IMAGING LENS | According clients specifications and needs. Several optical configurations available – Manual focus. |
| MECHANICAL ENCLOSURE | IP67 housing with embedded waterblock for air/watercooling temperature stabilization. |
| MECHANICAL INTERFACE | C-mount thread with counterthread for tight adjustment. |
| INFRARED CAMERA | VPD PbSe camera, 64×64 pixels (pixel size: 50 microns). Sensitive in the MWIR (1-5 microns). Fully Digital and snapshot type ROIC. |
| COMMUNICATION INTERFACE | Gigabit Ethernet (M12 connector) |
| SOFTWARE | Discover software suite: Including both analysis software and production software. |
| MINIMUM REQUIREMENTS | PC with processor i5, RAM memory: 8 GB Hard disk available: 1 GB, O.S.: Windows 10 or later (32/64 bits) |
| OTHER FEATURES | 2x digital input, 2x digital output (multiple functionalities) Process data logging. |
