This product is a 3.5-Inch form factor industrial mainboard which based on Intel® Tiger Lake-UP3 Processor Core™ i3-1115G4E / i5-1145G7E/ i7-1185G7E with Windows 10 IoT Enterprise 2021 (4 languages) supported.The industrial-grade GMB-L3TGL210/310/410, with size of 146mm x 102mm, has high computing power, triple-display capability, and various expansion slots make it well-suited for factory automation, intelligent transportation, digital signage, self-service kiosks, and medical applications. The Product supports two 260-pin DDR4-3200 SO-DIMM socket for up to 64GB of memory. To meet customer various needs, it also equipped with one Full-sized Mini PCIe slot with SIM socket. In addition, M.2 M key with mSATA support, and M.2 E key for wireless LAN require, it utilizes Intel® Iris® Xe Graphics to provide and feature triple-display capability through HDMI, DisplayPort and LVDS interfaces which enable multi-display in a limited space. Moreover, it has one RS-232/422/485 port, two RS-232 ports, total 3 ethernet ports with Intel controllers, four USB3.2 ports, two USB2.0 ports, audio interface (Mic-in, Line-out), one 4-bit GPIO port, one HDMI, one DisplayPort, and one LVDS port. The product can operates in temperature range from 0°C to 60°C and has +12~24V DC power supply input
Medical application
Factory automation
Self-service kiosks
Digital signage
| Type | 3.5-inch |
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| Supported OS | Windows 10 IoT Enterprise 2021 LTSC 64-bit |
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| CPU Generation (Development code) | 11th Gen. (Tiger Lake UP3) |
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| Processor | Core i7-1185G7E; Core i5-1145G7E; Core i3-1115G4E |
| CPU socket | – |
| Memory | up to 64GB |
| RAS | Hardware monitor (Fan speed / Temperature / Voltage); Watchdog timer |
| GPU | – |
| AI Performance | – |
| Security | TCG TPM 2.0 |
| Video | 1x DisplayPort; 1x HDMI; 1x LVDS |
|---|---|
| LAN | 2x 2500BASE-T |
| Wireless | – |
| Audio | – |
| I/O | 4x USB3.2 Gen2 |
| Memory card | – |
| Video | 1x USB 3.1 Gen1 (USB3.0) Type-C [DP Alt Mode] |
|---|---|
| LAN | |
| Audio | 1x Line out; 1x Mic-in |
| I/O | 2x USB2.0; 2x RS-232C; 1x RS-232C/422A/485 |
| Power connector | – |
| Expansion bus | 1x M.2 Key E (2230); 1x M.2 Key M (2280); 1x Mini PCI Express |
|---|---|
| Drive bay | – |
| Input voltage | 12 to 24VDC |
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| Operating temperature | 0 to 60°C (32 to 140°F) w/ 0.7m/s airflow |
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| Storage temperature | -10 to 70°C (14 to 158°F) |
| Standards & Certifications | CE; FCC Class A |
| Model | Description | Certification |
|---|---|---|
| GMB-L3TGL410-0LH | 3.5-inch SBC, Intel Tiger Lake-UP3 Core i7-1185G7E Processor, DDR4 SDRAM, with heat spreader |
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| GMB-L3TGL410-0LN | 3.5-inch SBC, Intel Tiger Lake-UP3 Core i7-1185G7E Processor, DDR4 SDRAM |
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| GMB-L3TGL310-0LH | 3.5-inch SBC, Intel Tiger Lake-UP3 Core i5-1145G7E Processor, DDR4 SDRAM, with heat spreader |
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| GMB-L3TGL310-0LN | 3.5-inch SBC, Intel Tiger Lake-UP3 Core i5-1145G7E Processor, DDR4 SDRAM |
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| GMB-L3TGL210-0LH | 3.5-inch SBC, Intel Tiger Lake-UP3 Core i3-1115G4E Processor, DDR4 SDRAM, with heat spreader |
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| GMB-L3TGL210-0LN | 3.5-inch SBC, Intel Tiger Lake-UP3 Core i3-1115G4E Processor, DDR4 SDRAM |
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