Enhance semiconductor package thermal quality assurance with a test solution combining precise thermal impedance measurement with high throughput automatic binning.
Simcenter Micred Quality Tester enables the assessment of a semiconductor package thermal structure to identify manufacturing defects, including die attach issues.
Trust in precision It uses accurate thermal impedance measurement in combination with automatic test equipment. Precise measurement of thermal response to a short power pulse allows high throughput semiconductor testing, including for junction-to-case thermal resistance verification. Junction temperature measurement is via electrical method using built-in Simcenter Micred T3STER technology.
Reach the gold standard As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal impedance curve and preset bandings of variation.
Understanding thermal performance and thermal reliability influences on semiconductor devices and IC packages are important during product development and across the electronics supply chain.
